Join Emerson at PACK EXPO 2024 - North Building, Level 3, Booth N-5345
Thank you for your interest in meeting the Emerson Discrete Automation team! We're eager to connect with you at PACK EXPO 2024 to discuss how our innovative Floor to Cloud™ approach to packaging will help you.
- Accelerate your drive to net zero by identifying areas that will deliver the biggest improvement opportunities
- Raise your manufacturing OEE machine by machine, increase your profitability and competitiveness
- Empower your workforce to deliver data driven improvements
Also, for the first time at PACK EXPO we will have an innovation stage where we will host several dynamic panel discussions and presentations throughout the week, please come along and join in.
Getting excited already? Complete and submit the form to receive your complimentary PACK EXPO 2024 pass.
Want to book an appointment in advance? Simply check the box, "I would like to talk to an Emerson Expert at the show” and identify your main area of interest. We’ll have the right expert contact you shortly to schedule an appointment.
